집적회로공정 18강 - Gate stack

1. Gate leakage current 2. Tunneling mechanisms 3. Evaluation of gate dielectric thickness 4. Equivalent oxide thickness (EOT) 5. High-k gate dielectric.

집적회로공정 19강 - Photolithography

1. Photolithography 2. Photomask layout 3. Photoresist / lift-off 4. Theory of photolithography

집적회로공정 20강 - Metallization

1. Interconnection RC time delay 2. Contact resistance 3. Aluminum metallization

집적회로공정 21강 - Metallization

1. Problems of aluminum metallization 2. Silicide process 3. Surface planarization 4. Damascene process

집적회로공정 22강 - Metallization/Scaling of CMOS

1. Self-aligned source and drain 2. Lightly doped drain (LDD) 3. Salicide process 4. Scaling trend of CMOS